Detectors work because they are made of some material which interacts with photons. Consider three general types
In a photon counting device, some fraction of incident photons hit a photosensitive material and eject a photoelectron. This electron is amplified numerous times to create a large ``swarm'' of electrons which is detected as a pulse. Thus, photons are ``counted'' as they come in. Simple photomultipliers do not retain any information about the location on the detector where the photon hits. There are some modern devices, however, called microchannel plates, which are essentially arrays of small photomultipliers where positional information can be obtained; one of the more common of these is called a MAMA, and exists in several instruments on the Hubble Space Telescope. Traditional photomultipliers were the workhorse of photometry from the 50's to the late 70's. More recently, a more sensitive type of photon counter, called an avalanche photo-diode, has been used.
Photon collecting array detectors are in more common usage today. In these devices, incoming photons create photoelectrons which are trapped in local potential wells. The amount of energy needed to eject a photoelectron depends on the type of material used. In the optical, silicon provides a good choice, but the excitation energy for silicon is too high to be used in the infrared. In the IR, various different substances are used, including HgCdTe, InSb, and PtSi. After a specified amount of time, the photoelectrons are ``counted''. The method by which this is done differs between different types of arrays. In CCDs, the charge is physically clocked down columns of the device, a single row at a time (a parallel transfer) then read out of serial register; CCDs are inherently asymmetric in rows and columns. In IR devices, each pixel is read individually, in sequence.
Detectors are characterized by a variety of different important quantities:
A/D converters can only measure a positive incoming signal. At low light levels, the true input signal can be negative in the presence of readout noise. To avoid trucation of the negative signals, a constant voltage, called the bias, is added to the signal before it passes through the A/D. This bias must later be removed to preserve the correct count ratios between different sources.
A/D convertors can introduce small systematic errors in recorded count rates if the reference voltages are not carefully controlled.
A related effect is fringing on chips, which results from interference of monochromatic incident light that is reflected from the substrate, which is relevant because the night sky spectrum contains strong monochromatic features. Since the substrate surface is not perfectly flat, this can lead to irregular patterns in the background. Examples: DIS red fringing, 1m i band imaging
By the nature of their operation, there are some additional effects which are peculiar to CCDs. The unique feature of CCDs is that they are used as shift registers to transfer the charge through the detectors themselves in the process of readout. The parallel transfer efficiency (transfer efficiency from one row to the next) must be extremely good in order not to lose any significant amount of charge over the large number of parallel transfers which must be performed (especially in larger devices). For example, a charge transfer efficiency (CTE) of 0.999 per transfer, which sounds good, will result in a loss of 64% of the signal over 1024 transfers, or 83% of the signal over 2048 transfers! For detectors of these sizes, CTE's of order 0.99999 or better are required. Fortunately, they are achievable, though not trivially so; many devices are rejected because of inadequate CTE.
Charge transfer problems can lead to a variety of effects which are often encountered by CCD users, especially those pushing for the most accurate photometry. An example of one such problem is known as deferred charge. This occurs because some CCDs transfer charge less efficiently at very low light levels. Essentially, this makes the detector non-linear at low light levels. Deferred charge can be corrected for if exposure levels are above the level where the nonlinearities are important. Alternatively, if low light levels are expected, detectors which exhibit this problem can be ``pre-flashed'' in which a background level of photons is put on the chip before the exposure is started; when one does this, however, one must pay the price of additional background noise.
CTE problems are apparently exacerbated by exposure to high energy photons, and, as a result, often plague space-based missions, where the CTE performance can degrade over time. There has been some technology development to mitigate this problem, but it is definitely an issue.
The manufacture of CCDs, especially the low noise devices with high quantum efficiency which are needed by astronomers, is a complex procedure; only several manufacturers currently attempt this. The quality of a CCD is generally specified by its quantum efficiency (as a function of wavelength), its readout noise, and charge transfer efficiency (though there are other figures of merit as well).
CCDs can either be illuminated from the front side (where the electronics are implanted) or from the back side. To work efficiently when back-illuminated, the chips must be thinned by some process. Generally, thinned back-side illuminated chips have higher quantum efficiencies than front-side illuminated chips. However, the thinning process can be difficult, with a relatively high fraction of attempts at thinning ending in failure. Front-side illuminated chips not only have lower quantum efficiencies, but tend to have particularly poor blue response.
An additional way to improve blue (or any) response is to coat the chip either with some sort of anti-reflection coating to minimize reflective losses, or with some sort of lumogen which converts blue (or UV) photons to longer wavelengths where the chip is more sensitive.
The quantum efficiency is never totally uniform over the entire chip. Pixel-to-pixel variations in q.e. are typically a few percent. Over larger scales, q.e. variations can be larger; larger q.e. variations are often found in thinned chips because the thinning process may be non-uniform. The variations in q.e. across the chip, along with possible differences in illumination pattern across the chip, leads to the necessity of flat-fielding.
An additional consideration rarely considered is whether there are quantum efficiency variations within each pixel. In the limit where sources are very well sampled (i.e. cover many pixels), these are irrelevant, but they would lead to direct systematic photometric errors in the situation where sources are undersampled. Little is known about the possibility of such variations in different devices, but it is likely that they exist at some level.
QE as a function of time, e.g. short term, long term, thermal cycling variations. Requirements for calibration. Of course, there may be other things in the optical system that lead to time-dependent sensitivity variations as a function of position, e.g. dust specks on the dewar window or filter.
Infrared arrays operate under different principles than CCDs. First, a different material must be used, because silicon is not sensitive in the IR. PtSi, HgCdTe, InSb. Typical QE is not quite as good as that in typical CCDs, but it is constantly improving. Typical array sizes are also slightly smaller than currently available for CCDs.
In general, there is less experience with materials which are sensitive to infrared photons than there is with silicon. As a result, the infrared arrays cannot be used as readout registers in the way in which silicon arrays (CCDs) are. Instead, the IR arrays are generally coupled to a silicon array (a multiplexer). For some reason, they are generally not coupled to CCDs, however. Each pixel from the multiplexer array is read out individually, in sequence; charge is not transferred from one pixel to another. In IR arrays, each pixel can be thought of as a capacitor; as photons are detected, charge builds up on the capacitor. The amount of charge on the capacitor can be read out at any time, without affecting the accumulated charge. This leads to so-called nondestructive readouts for IR devices; a given pixel can be read out many times without removing the accumulated charge. The removal of charge is done in a seperate reset operation.
Before charge accumulation begins, each pixel is reset to some initial value. Because of thermal noise (often called KTC noise), however, it is not possible to know precisely what this initial value is from one reset operation to the next. This would introduce a fundamental uncertainty in the total charge measured if one only read each pixel once at the end of the desired integration period. To avoid this, most astronomical IR detectors perform doubly-correlated sampling, in which the array is read shortly after reset (non-destructively) and then again at the end of a specified integration period. The difference between the two readouts give the desired counts per integration period. To lower the effect of readout noise, it is possible that during each of these readouts, the chip is actually read several times; averaging the successive differences reduces the effective readout noise. Alternatively, one can do ``up the ramp'' (e.g. multiaccum, Fowler) sampling as the exposure proceeds.
Because each pixel is read in sequence, and only the time difference between the reads is relevant, many IR cameras are run without shutters.
QE differences between different types of IR devices: HgCdTe vs. InSb. Tuning long wavelength cutoff, e.g. in HgCdTe.
Subpixel QE.
Readout noise considerations more relevant because of low background, photon counting devices preferred, e.g. MAMAs.